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Infineon Technologies IRFS3107TRL7PP

IRFS3107TRL7PP N-Channel MOSFET, 75V 240A, 2.6 mOhm Rds(on)

MPNIRFS3107TRL7PP
End of Life

IRFS3107TRL7PP, HEXFET® N-Channel MOSFET, 75 V Vdss, 240 A Id, 2.6 mOhm Rds(on) at 10 V, 240 nC Qg, D2PAK-7, -55 to 175 °C.

$5.73Ref. price · indicative, final on quote
PackagingTO-263-7, D²Pak (6 Leads + Tab), TO-263CB
RoHSROHS3 Compliant
SeriesHEXFET®
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

IRFS3107TRL7PP specifications
ParameterValue
SeriesHEXFET®
FET typeN-Channel
MountingSurface Mount
Drain to source voltage75 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C240A (Tc)
Power dissipation370W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-263-7, D²Pak (6 Leads + Tab), TO-263CB
Vgs(th) (Max) @ id4V @ 250µA
Rds on (Max) @ id, vgs2.6mOhm @ 160A, 10V
Gate charge (Qg) (Max) @ vgs240 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds9200 pF @ 50 V

Product details

75 V, 240 A — the switching MOSFET for high-current rails

The IRFS3107TRL7PP: The 2.6 mOhm maximum Rds(on) at Vgs=10 V and 160 A sets the conduction loss floor for high-current switching stages.

At 160 A drain current and Vgs=10 V the maximum on-resistance is 2.6 mOhm. That 2.6 mOhm at 160 A means 67 W conduction loss at 25 °C junction — the 370 W package dissipation limit gives headroom for switching loss, but only if the heatsink keeps Tc below 100 °C. The die is sized for this current density; the limiting factor is the D2PAK leadframe's ability to sink heat into the board copper.

240 nC gate charge — driver current budget

Total gate charge at Vgs=10 V is 240 nC. The 9200 pF input capacitance at Vds=50 V means the driver must source a 9.2 nF load per switching edge — a standard totem-pole driver with 2 A peak output handles the transition in roughly 100 ns, but the 240 nC total charge sets the gate-loop energy per cycle.

D2PAK-7 footprint — not the standard TO-263-3

The package is a 7-lead D2PAK (TO-263-7) with six leads plus the tab. The extra leads are typically multiple drain connections or Kelvin source — they reduce package resistance and improve current sharing. The PCB land pattern must match the 7-lead footprint; a standard 3-lead D2PAK pad layout will leave the outer pads unconnected. Surface-mount assembly with the large tab requires a solder-paste stencil that covers the exposed pad for thermal transfer.

Frequently asked questions

Can IRFS3107TRL7PP replace IRFS3107PBF?

Both are 75 V N-channel HEXFETs in a D2PAK package, but the TRL7PP suffix indicates a 7-lead variant versus the standard 3-lead PBF. The pinout and PCB land pattern differ — the 7-lead part has additional drain or sense connections. Verify the pad layout before substituting.

What package does IRFS3107TRL7PP use?

It uses a TO-263-7 (D2PAK) surface-mount package with 6 leads plus a tab, also described as a 7-lead D2PAK.