On-resistance and conduction loss
The IRFS3006TRL7PP: Maximum on-resistance is 2.1 mOhm at 168 A drain current with a 10 V gate drive. The 375 W maximum power dissipation at case temperature gives the thermal budget headroom. The 10 V drive voltage is the recommended gate drive for achieving the specified Rds(on).
Switching characteristics and gate drive
Gate charge is 300 nC at 10 V. Input capacitance is 8850 pF at 50 V drain-to-source. The ±20 V maximum gate-to-source voltage gives good margin for gate-drive overshoot.
Package and mounting
The TO-263-7 D²Pak (also called D2PAK-7) is a surface-mount power package with a large exposed copper tab for thermal conduction to the PCB. The seven leads include an extra source connection that lowers the package resistance and improves current sharing versus the standard 3-lead D²Pak. The supplier device package is D2PAK (7-Lead). Mounting requires a copper land pattern with adequate thermal vias to a heatsink layer; the tab is the drain connection and must be isolated or connected accordingly. This part is supplied in Tape & Reel or Cut Tape options, so it is compatible with automated pick-and-place assembly.
Lifecycle and compliance
It is ROHS3 compliant, so it meets the latest EU restriction-of-hazardous-substances directive for lead-free soldering processes. The HEXFET® series is an established Infineon power MOSFET family with broad application support and multiple second-source options in similar voltage/current classes.