Package and mounting — DPAK with a 99 W dissipation ceiling
The DPAK (TO-252) surface-mount package with two leads and a tab carries a 99 W maximum power dissipation at case temperature. The tab is the drain connection; PCB copper area on the drain pad is the primary heatsink. For continuous 56 A operation, the board layout needs a substantial copper pour and preferably a thermal via array to an inner-layer plane. The part is supplied in Tape & Reel or Cut Tape options, which suits both high-volume reflow and prototype builds.
Lifecycle and compliance — active, ROHS3, no LTB risk
The IRFR7546TRPBF is listed as Active on Infineon's product status, with ROHS3 compliance. No end-of-life notice or last-time-buy window is in effect for this BOM line.