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Infineon Technologies IRFR6215TRLPBF

IRFR6215TRLPBF P-Channel MOSFET, 150V 13A DPAK

MPNIRFR6215TRLPBF
End of Life

Infineon HEXFET IRFR6215TRLPBF, P-Channel MOSFET, 150 V Vdss, 13 A Id, 295 mOhm Rds(on) max at 10 Vgs, D-Pak (TO-252) surface mount, -55°C to 175°C.

$1.4Ref. price · indicative, final on quote
PackagingTO-252-3, DPak (2 Leads + Tab), SC-63
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

IRFR6215TRLPBF Technical Specifications
ParameterValue
SeriesHEXFET®
FET typeP-Channel
Mounting typeSurface Mount
Drain to source voltage150 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C13A (Tc)
Power dissipation110W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-252-3, DPak (2 Leads + Tab), SC-63
Vgs(th) (Max) @ id4V @ 250µA
Rds on (Max) @ id, vgs295mOhm @ 6.6A, 10V
Gate charge (Qg) (Max) @ vgs66 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds860 pF @ 25 V

Product details

Switching and drive considerations

Gate charge totals 66 nC at 10 V, so a gate driver sourcing 1 A can switch the FET in roughly 66 ns — fast enough for mid-frequency SMPS and motor pre-drive stages. Input capacitance is 860 pF at 25 V drain bias, which influences the driver's peak current requirement and the switching losses at higher frequencies. The gate threshold voltage is specified at 4 V maximum with 250 µA drain current, meaning a 5 V logic-level gate drive will not fully enhance the channel — the datasheet recommends 10 V drive to achieve the rated Rds(on).

Thermal and environmental reach

The 175°C maximum junction also provides headroom in high-current designs where self-heating pushes the die temperature well above the board ambient.

Package and footprint

Housed in the standard D-Pak (TO-252-3, DPAK) surface-mount package, the IRFR6215TRLPBF uses the exposed tab (drain) as the primary thermal path — the PCB copper area under the tab sets the junction-to-ambient thermal resistance. The 0.50 mm pitch leads are compatible with standard DPAK land patterns.

Frequently asked questions

What is the datasheet for IRFR6215TRLPBF?

Buyers need to verify electrical parameters and footprint compatibility before design-in.

Where can I buy IRFR6215TRLPBF?

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What is the price of IRFR6215TRLPBF in bulk?

BOM planners require unit pricing for cost calculations.

Is IRFR6215TRLPBF obsolete or active?

Design engineers need lifecycle status to avoid end-of-life risks.

What is the equivalent replacement for IRFR6215TRLPBF?

Maintenance techs or buyers may need alternatives if the part is unavailable.

What is the pinout of IRFR6215TRLPBF?

Design engineers need to confirm pin compatibility with existing layouts.