100 V, 16 A N-channel — the HEXFET switching workhorse
The 115 mOhm maximum on-resistance at 10 A gate drive of 10 V defines the conduction loss floor. The 79 W package thermal capability can handle the dissipation with adequate copper area on the drain tab.
Temperature range and package — design-in notes
This suits the part for engine-bay electronics, industrial motor drives, and other high-ambient environments where the die sees sustained thermal stress. The 79 W maximum power dissipation assumes the tab is held at 25°C — real-world derating follows the package's thermal resistance, which depends on board copper area and airflow.