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Infineon Technologies IRFHS8242TRPBF

IRFHS8242TRPBF HEXFET N-Ch 25V 9.9A/21A 6-PQFN

MPNIRFHS8242TRPBF
End of Life

Infineon HEXFET N-Channel MOSFET, 25 V Vdss, 9.9 A (Ta) / 21 A (Tc) continuous drain, 13 mOhm Rds(on) at 8.5 A, 10 V, 10.4 nC gate charge, 6-PQFN (2x2) DFN2020 package, -55 to 150 °C junction.

$0.54Ref. price · indicative, final on quote
Packaging6-PowerVDFN
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

IRFHS8242TRPBF Technical Specifications
ParameterValue
SeriesHEXFET®
FET typeN-Channel
Mounting typeSurface Mount
Drain to source voltage25 V
Drive voltage (Max rds on, min rds on)4.5V, 10V
Current - continuous drain (Id) @ 25°C9.9A (Ta), 21A (Tc)
Power dissipation2.1W (Ta)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
Case6-PowerVDFN
Vgs(th) (Max) @ id2.35V @ 25µA
Rds on (Max) @ id, vgs13mOhm @ 8.5A, 10V
Gate charge (Qg) (Max) @ vgs10.4 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds653 pF @ 10 V

Product details

13 mOhm Rds(on) in a 2x2 mm footprint — sizing the switch

The IRFHS8242TRPBF is an N-channel HEXFET MOSFET rated for 25 V drain-source and 9.9 A continuous drain at 25 °C ambient, or 21 A referenced to the case.

Gate charge and switching — what the 10.4 nC means for the driver

Total gate charge at 10 V is 10.4 nC. Input capacitance is 653 pF at 10 V drain-source.

DFN2020 layout — thermal vias and solder paste area

The 6-PQFN (2x2 mm) package, supplier code DFN2020, has an exposed drain pad on the bottom. The 2.1 W Ta dissipation assumes the standard JEDEC 1-inch-square copper pad on a 1 oz board — real-world performance depends on the number and diameter of thermal vias under the pad. For a 2-layer board, at least four 0.3 mm vias filled with solder are typical to pull heat into the inner ground plane. The 0.50 mm pitch on the side leads demands a solder paste stencil aperture that does not bridge to the centre pad.

Frequently asked questions

What is the Rds(on) for IRFHS8242TRPBF?

At 4.5 V gate drive the on-resistance will be higher — the datasheet typical curve should be consulted for the exact value at the operating point.

Is IRFHS8242TRPBF RoHS compliant?

Yes, the part is listed as ROHS3 Compliant.