IRFH8325TRPBF

Infineon Technologies · HEXFET® Series

IRFH8325TRPBF, HEXFET N-Channel MOSFET, 30 V Vdss, 21 A (Ta) / 82 A (Tc) continuous drain, 5 mOhm Rds(on) max at 20 A, 10 V, 32 nC gate charge, 8-PowerTDFN (PQFN 5x6) package, -55°C to 150°C junction.

Infineon Technologies IRFH8325TRPBF
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

IRFH8325TRPBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®
FET typeN-Channel
MountingSurface Mount
Drain to source voltage30 V
Drive voltage (Max rds on, min rds on)4.5V, 10V
Current - continuous drain (Id) @ 25°C21A (Ta), 82A (Tc)
Power dissipation3.6W (Ta), 54W (Tc)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
Case8-PowerTDFN
Vgs(th) (Max) @ id2.35V @ 50µA
Rds on (Max) @ id, vgs5mOhm @ 20A, 10V
Gate charge (Qg) (Max) @ vgs32 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds2487 pF @ 10 V

Technical details

5 mOhm at 20 A — the conduction loss floor

The IRFH8325TRPBF is a 30 V, N-Channel HEXFET power MOSFET in the 8-PowerTDFN (PQFN 5x6) package. Its headline on-resistance is 5 mOhm max at Vgs=10 V and Id=20 A — the figure that sets the I²R conduction loss in a synchronous buck or load switch. At 20 A the drop is 100 mV, which keeps die temperature rise manageable even with the 3.6 W (Ta) / 54 W (Tc) dissipation ceiling.

Gate charge and drive voltage flexibility

Total gate charge is 32 nC at Vgs=10 V. That is a moderate figure — a 1 A gate driver at 500 kHz switching frequency would burn about 16 mA of drive current from the bias rail, leaving headroom for the driver's own losses. The drive voltage range spans 4.5 V to 10 V (min and max Rds(on) points), so the part works with either 5 V logic-level gate drive or a standard 10 V rail. Below 4.5 V the on-resistance climbs steeply — the 2.35 V threshold at 50 µA is a weak turn-on, not a logic-level guarantee.

Current rating — Ta vs Tc matters

That 4× spread reflects the thermal resistance difference: 3.6 W max in still air vs 54 W when the PQFN exposed pad is soldered to a copper plane. For a real BOM, the usable current is the lower of the two unless the board has a dedicated heatsink or forced airflow.

The 8-PowerTDFN (PQFN 5x6) has a large exposed pad on the bottom. The 2487 pF input capacitance at Vds=10 V is moderate — the gate driver sees a ~32 nC charge packet, so rise/fall times in the 10–20 ns range are achievable with a 2 A driver.

It is ROHS3 compliant. The HEXFET series is an established Infineon (formerly International Rectifier) trench MOSFET family; no official second-source cross-reference is listed in the procurement data, so dual-sourcing would require qualifying a pin-compatible N-channel from another vendor with similar Rds(on) and Qg.

IRFH8325TRPBF
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