IRFH5302TRPBF

Infineon Technologies · HEXFET® Series

Infineon HEXFET IRFH5302TRPBF, N-Channel MOSFET, 30 Vdss, 2.1 mOhm Rds(on) at 50 A, 10 V, 76 nC gate charge, PQFN (5x6) Single Die, -55°C to 150°C junction.

Infineon Technologies IRFH5302TRPBF
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[IN STOCK] In Stock: 3,475 pcs
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

IRFH5302TRPBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®
FET typeN-Channel
MountingSurface Mount
Drain to source voltage30 V
Drive voltage (Max rds on, min rds on)4.5V, 10V
Current - continuous drain (Id) @ 25°C32A (Ta), 100A (Tc)
Power dissipation3.6W (Ta), 100W (Tc)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
Case8-PowerVDFN
Vgs(th) (Max) @ id2.35V @ 100µA
Rds on (Max) @ id, vgs2.1mOhm @ 50A, 10V
Gate charge (Qg) (Max) @ vgs76 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds4400 pF @ 15 V

Technical details

2.1 mOhm at 50 A — the conduction loss floor

The Infineon IRFH5302TRPBF is an N-channel HEXFET MOSFET in a PQFN (5x6) Single Die package. Continuous drain current is rated 32 A at 25°C ambient (Ta) and 100 A at case temperature (Tc). The Ta figure is the practical limit for a bare board layout; the Tc figure is the die capability with the paddle soldered to a sufficient copper area.

Total gate charge Qg is 76 nC at Vgs = 10 V. Input capacitance Ciss is 4400 pF at Vds = 15 V.

Power dissipation is derated to 3.6 W at ambient (Ta) and 100 W at case (Tc). The 3.6 W Ta limit reflects the PQFN (5x6) thermal resistance with standard PCB copper; the 100 W Tc figure assumes the exposed paddle is soldered to a thermal plane with adequate via array.

Active production — ROHS3 compliant

ROHS3 compliant.

IRFH5302TRPBF
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