IRFH5015TRPBF

Infineon Technologies · HEXFET® Series

Infineon IRFH5015TRPBF HEXFET N-Channel MOSFET, 150 V drain-source, 56 A continuous drain (Tc), 31 mOhm Rds(on) at 34 A, 10 V gate drive, 50 nC gate charge, 8-PQFN (5x6 mm) package, -55 to 150 °C junction temperature.

Infineon Technologies IRFH5015TRPBF
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[IN STOCK] In Stock: 2,000 pcs
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

IRFH5015TRPBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®
FET typeN-Channel
MountingSurface Mount
Drain to source voltage150 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C10A (Ta), 56A (Tc)
Power dissipation3.6W (Ta), 156W (Tc)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
Case8-PowerTDFN
Vgs(th) (Max) @ id5V @ 150µA
Rds on (Max) @ id, vgs31mOhm @ 34A, 10V
Gate charge (Qg) (Max) @ vgs50 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds2300 pF @ 50 V

Technical details

150 V, 56 A N-channel — the switching anchor for 48 V and 72 V rails

It comes in an 8-PQFN (5x6 mm) surface-mount package, the 8-PowerTDFN footprint common in mid-power DC-DC converters, motor-drive stages, and battery-management switches. The 150 V rating gives headroom for 48 V and 72 V nominal buses — including the transients on a 48 V telecom rectifier or a 72 V e-bike battery pack. The 56 A continuous drain at Tc lets it handle the full-load current of a 3 kW motor drive or a 2.5 kW DC-DC converter with adequate heatsinking.

For a 100 kHz switching frequency, the average gate-drive current is 5 mA; the peak current the driver must source for a 10 ns rise time is about 2.3 A. A standard 1 A gate-driver IC will struggle to keep the switching edges clean — budget a 2 A or higher driver for hard-switching topologies.

Package and thermal — the 8-PQFN footprint

The 3.6 W dissipation at ambient (Ta) is the free-air limit without a heatsink — for any real load above a few amps, the board copper and airflow are the thermal design.

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