IRFB4310ZPBF

Infineon Technologies · HEXFET® Series

Infineon HEXFET IRFB4310ZPBF, N-Channel MOSFET, 100 V Vdss, 120 A Id, 6 mOhm Rds(on) at 75 A, 10 V, 170 nC gate charge, TO-220-3 through-hole, -55 to 175 °C.

Infineon Technologies IRFB4310ZPBF
[IN STOCK] In Stock: 4,744 pcs
$1.48/ pc

Volume pricing

Buy Now

MOQ 1 · Tube · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

IRFB4310ZPBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®
FET typeN-Channel
MountingThrough Hole
Drain to source voltage100 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C120A (Tc)
Power dissipation250W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTube
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-220-3
Vgs(th) (Max) @ id4V @ 150µA
Rds on (Max) @ id, vgs6mOhm @ 75A, 10V
Gate charge (Qg) (Max) @ vgs170 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds6860 pF @ 50 V

Technical details

100 V, 120 A N-channel HEXFET in TO-220-3

Conduction and switching parametrics

At 75 A and 6 mOhm, I²R dissipation is 33.75 W, which must be sunk through the TO-220 tab to keep junction temperature below the 175 °C absolute maximum. A 10 V gate rail ensures the device is fully enhanced; driving with 5 V logic may leave the FET in the linear region at high current.

Junction temperature range is -55 °C to 175 °C, which qualifies the part for under-hood automotive and industrial enclosure environments where ambient temperatures can exceed 85 °C. The TO-220AB (TO-220-3 variant) package has a standard 0.100-inch pitch and a metal tab for screw or clip heatsink attachment.

It is ROHS3 compliant, which means no exemptions for lead in solder or other restricted substances.

IRFB4310ZPBF
[ALLOC] verified
Quote