IRFB3306PBF

Infineon Technologies · HEXFET® Series

Infineon HEXFET® series, IRFB3306PBF, N-Channel MOSFET, 60 V Vdss, 120 A Id, 4.2 mOhm Rds(on) at 10 V, 120 nC Qg, TO-220AB through-hole, -55°C to 175°C.

Infineon Technologies IRFB3306PBF
Download datasheet (PDF)
[IN STOCK] In Stock: 222 pcs
$1.49/ pc

Volume pricing

Buy Now

MOQ 1 · Tube · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

IRFB3306PBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®
FET typeN-Channel
MountingThrough Hole
Drain to source voltage60 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C120A (Tc)
Power dissipation230W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTube
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-220-3
Vgs(th) (Max) @ id4V @ 150µA
Rds on (Max) @ id, vgs4.2mOhm @ 75A, 10V
Gate charge (Qg) (Max) @ vgs120 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds4520 pF @ 50 V

Technical details

60 V, 120 A N-channel HEXFET — the conduction-loss floor

It is designed for high-current switching and linear applications where low on-resistance and high junction temperature tolerance are required.

120 nC gate charge — switching-frequency budget

Total gate charge Qg is 120 nC at 10 V. The 4 V gate-threshold maximum at 150 µA drain current means the device is fully enhanced with a 10 V drive, but the threshold spread leaves no headroom for 5 V logic drive — a 10 V rail is required to hit the rated Rds(on).

At 175°C junction, the Rds(on) roughly doubles from the 25°C value — expect about 8.4 mOhm at the hot corner, which must be factored into the thermal design for continuous operation above 125°C.

TO-220AB — through-hole thermal interface

The TO-220AB package provides a metal tab for direct heatsink mounting. The through-hole mounting suits point-to-point wiring, terminal-block assemblies, and board-level replacement in existing designs where surface-mount reflow is not an option.

IRFB3306PBF
[ALLOC] verified
Quote