IRFB3207ZPBF

Infineon Technologies · HEXFET® Series

Infineon HEXFET IRFB3207ZPBF, N-Channel MOSFET, 75 V Vdss, 120 A Id, 4.1 mOhm Rds(on) at 75 A, 10 V, 170 nC Qg, TO-220AB, -55°C to 175°C.

Infineon Technologies IRFB3207ZPBF
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Technical specifications

IRFB3207ZPBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®
FET typeN-Channel
MountingThrough Hole
Drain to source voltage75 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C120A (Tc)
Power dissipation300W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTube
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-220-3
Vgs(th) (Max) @ id4V @ 150µA
Rds on (Max) @ id, vgs4.1mOhm @ 75A, 10V
Gate charge (Qg) (Max) @ vgs170 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds6920 pF @ 50 V

Technical details

Total gate charge Qg is 170 nC at Vgs = 10 V. The input capacitance Ciss is 6920 pF at Vds = 50 V, which sets the driver's source/sink resistance requirement for clean edges without ringing.

Temperature range and package — TO-220AB with 175°C junction

The TO-220AB through-hole package (TO-220-3) allows heatsink mounting with a screw or clip; the 300 W power dissipation rating at the case is achievable only with adequate heatsinking and forced airflow.

It is ROHS3 compliant.

IRFB3207ZPBF
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