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Infineon Technologies IRFAC30 — Discrete Semiconductors

IRFAC30 N-Channel MOSFET, 600V, 2.5 Ohm Rds(on), HEXFET

MPNIRFAC30
Active

IRFAC30, N-Channel HEXFET® MOSFET, 600 V, 3.6 A, 2.5 Ohm Rds(on) @ 3.6 A, 10 V, ±20 V Vgs, 75 W, Through Hole, Bulk, -55°C to 150°C TJ.

$4.71Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

IRFAC30 specifications
ParameterValue
SeriesHEXFET®
FET typeN-Channel
MountingThrough Hole
Operating temperature high-55°C to 150°C(TJ)
Vgs±20 V
Power75.0
Package_typeBulk
Capacitance_uf0.0006
StatusActive
Supply voltage600.0
Vgs(Th) (Max) @ id4 V @ 250µA
Switching current3.6
Rds on (Max) @ id, vgs2.5Ohm @ 3.6 A, 10 V
Gate charge (Qg) (Max) @ vgs38 nC @ 10 V

Product details

600 V N-channel HEXFET — hermetic, through-hole

It is designed for high-reliability applications where sealed-device construction is required — avionics, satellite power systems, downhole instrumentation, and military-grade power converters. The 2.5 Ohm maximum on-resistance at 3.6 A, 10 V gate drive sets the conduction loss baseline for the BOM.

At 2.5 Ohm max with 10 V gate drive, this part is a standard-threshold MOSFET. The 4 V threshold at 250 µA is typical for the family.

Temperature range and package — application fit

The hermetic construction (the description notes N-CHANNEL HERMETIC MOS HEXFET) means the die is sealed against moisture and contamination — a requirement for long-life mission equipment and sealed enclosures where conformal coating alone is insufficient. The through-hole mounting suits point-to-point wiring, terminal blocks, or high-vibration chassis mounting where a solder joint alone is not the primary mechanical retention.

Frequently asked questions

What is the Rds(on) of IRFAC30?

The maximum on-resistance is 2.5 Ohm at a drain current of 3.6 A with a 10 V gate drive.