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Infineon Technologies IRF9Z34NSTRLPBF

IRF9Z34NSTRLPBF P-Channel MOSFET, 55V 19A D2PAK

MPNIRF9Z34NSTRLPBF
End of Life

Infineon HEXFET IRF9Z34NSTRLPBF, P-Channel MOSFET, 55V Vdss, 19A Id, 100mOhm Rds(on) @ 10V, D2PAK (TO-263), -55°C to 175°C.

$1.48Ref. price · indicative, final on quote
PackagingTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

IRF9Z34NSTRLPBF Technical Specifications
ParameterValue
SeriesHEXFET®
FET typeP-Channel
Mounting typeSurface Mount
Drain to source voltage55 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C19A (Tc)
Power dissipation3.8W (Ta), 68W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Vgs(th) (Max) @ id4V @ 250µA
Rds on (Max) @ id, vgs100mOhm @ 10A, 10V
Gate charge (Qg) (Max) @ vgs35 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds620 pF @ 25 V

Product details

P-Channel HEXFET in D2PAK — 55 V, 19 A, 100 mOhm

The Infineon IRF9Z34NSTRLPBF is a P-Channel enhancement-mode MOSFET from the HEXFET series, housed in a surface-mount D2PAK (TO-263) package. It is rated for a drain-to-source voltage of 55 V and a continuous drain current of 19 A at 25°C case temperature. The maximum on-resistance is 100 mOhm at a 10 A drain current with a 10 V gate drive. This part is suited for load switching, power management, and DC-DC converter applications where a P-Channel device simplifies high-side drive circuitry.

Ratings that drive the BOM decision

The junction temperature range spans -55°C to 175°C, covering military and industrial temperature extremes. This makes the part usable in outdoor telecom, engine bay electronics, and other high-temperature environments where commercial-grade parts would derate or fail.

Package and mounting

The D2PAK (TO-263) surface-mount package has a large metal tab for heat transfer to the PCB copper plane. The tab is the drain connection. The two-lead plus tab configuration requires a PCB footprint with adequate copper area for thermal dissipation. The part is supplied on Tape & Reel, compatible with automated pick-and-place assembly.

Lifecycle and sourcing

The IRF9Z34NSTRLPBF is listed as Active with ROHS3 compliance. No end-of-life notice or last-time-buy is indicated. For production BOMs, this part is available to order through independent distribution. No direct pin-compatible second source is listed in the available records, so dual-sourcing would require qualification of an alternative P-Channel MOSFET with similar Rds(on) and gate charge.

Frequently asked questions

What is the Rds(on) of IRF9Z34NSTRLPBF?

The maximum on-resistance is 100 mOhm at a drain current of 10 A with a 10 V gate drive.