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Infineon Technologies IRF9540NSTRLPBF — Discrete Semiconductors

IRF9540NSTRLPBF P-Channel HEXFET MOSFET, 100V, 23A, D2PAK

MPNIRF9540NSTRLPBF
Active

Infineon HEXFET® P-Channel MOSFET, IRF9540NSTRLPBF, 100V Vdss, 23A Id, 117mOhm Rds(on) at 10V Vgs, D2PAK (TO-263) surface-mount, -55°C to 150°C junction temperature.

$1.9100Ref. price · indicative, final on quote
PackagingTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
RoHSROHS3 Compliant
SeriesHEXFET®
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

IRF9540NSTRLPBF specifications
ParameterValue
SeriesHEXFET®
FET typeP-Channel
MountingSurface Mount
Drain to source voltage100 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C23A (Tc)
Power dissipation3.1W (Ta), 110W (Tc)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR) Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Vgs(th) (Max) @ id4V @ 250µA
Rds on (Max) @ id, vgs117mOhm @ 14A, 10V
Gate charge (Qg) (Max) @ vgs110 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds1450 pF @ 25 V

Product details

The IRF9540NSTRLPBF: The maximum Rds(on) is 117 mOhm at 14 A and 10 V Vgs. The total gate charge is 110 nC at 10 V.

Package and thermal path — D2PAK mounting

The maximum power dissipation is 3.1 W at 25°C ambient and 110 W at 25°C case — the difference reflects the thermal resistance of the board. For high-current designs, a 2 oz copper pour under the tab is typical.

Temperature grade and application envelope

The 100 V Vdss and 23 A Id rating suit it for 48 V bus converters, battery-protection circuits, and high-side load switches in power-train and motor-drive applications.

Frequently asked questions

Can IRF9540NSTRLPBF replace IRF9540N in a circuit?

The IRF9540NSTRLPBF is a surface-mount D2PAK variant of the IRF9540N series. The base product number is IRF9540. The electrical specifications — 100 V Vdss, 23 A Id, 117 mOhm Rds(on) — are consistent with the IRF9540N family. The main difference is the package: D2PAK vs through-hole. If the board layout accommodates the D2PAK footprint and the thermal path, it is a direct functional replacement.