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Infineon Technologies IRF9383MTRPBF

IRF9383MTRPBF P-Channel MOSFET, 30V, 22A DirectFET MX

MPNIRF9383MTRPBF
End of Life

Infineon IRF9383MTRPBF, HEXFET series, P-Channel MOSFET, 30V Vdss, 22A continuous drain at Ta, 160A at Tc, 2.9mOhm Rds(on) at 10V, DirectFET Isometric MX package, surface mount, -40°C to 150°C junction.

$3.45Ref. price · indicative, final on quote
PackagingDirectFET™ Isometric MX
RoHSROHS3 Compliant
SeriesHEXFET®
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

IRF9383MTRPBF specifications
ParameterValue
SeriesHEXFET®
FET typeP-Channel
MountingSurface Mount
Drain to source voltage30 V
Drive voltage (Max rds on, min rds on)4.5V, 10V
Current - continuous drain (Id) @ 25°C22A (Ta), 160A (Tc)
Power dissipation2.1W (Ta), 113W (Tc)
Operating temperature-40°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseDirectFET™ Isometric MX
Vgs(th) (Max) @ id2.4V @ 150µA
Rds on (Max) @ id, vgs2.9mOhm @ 22A, 10V
Gate charge (Qg) (Max) @ vgs130 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds7305 pF @ 15 V

Product details

P-Channel 30 V HEXFET in DirectFET MX

The IRF9383MTRPBF is a P-Channel enhancement-mode MOSFET from Infineon's HEXFET family, rated for 30 V drain-to-source and 22 A continuous drain at ambient (160 A at case) with a maximum Rds(on) of 2.9 mOhm at 10 V gate drive. The DirectFET Isometric MX package is a large-die, solderable-can design that conducts heat directly into the PCB — layout must match the footprint for low inductance and effective thermal vias. Applications include high-side load switching, battery protection, and DC-DC converter synchronous rectification in power supplies and automotive systems.

The DirectFET Isometric MX package is a leadless can with a large solderable backside that doubles as the drain connection and primary thermal path. The 113 W case-rated power dissipation assumes a well-designed PCB with thermal vias under the can to spread heat into the board copper. Surface-mount assembly requires a solder profile compatible with the can finish — no through-hole, no heatsink clip.

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