IRF9335TRPBF

Infineon Technologies · HEXFET® Series

IRF9335TRPBF, HEXFET® Series, P-Channel MOSFET, 30V Vdss, 5.4A Id, 59mOhm Rds(on) at 10V, 14nC Qg, 8-SOIC package, -55°C to 150°C.

Infineon Technologies IRF9335TRPBF
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

IRF9335TRPBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®
FET typeP-Channel
MountingSurface Mount
Drain to source voltage30 V
Drive voltage (Max rds on, min rds on)4.5V, 10V
Current - continuous drain (Id) @ 25°C5.4A (Ta)
Power dissipation2.5W (Ta)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
Case8-SOIC (0.154\", 3.90mm Width)
Vgs(th) (Max) @ id2.4V @ 10µA
Rds on (Max) @ id, vgs59mOhm @ 5.4A, 10V
Gate charge (Qg) (Max) @ vgs14 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds386 pF @ 25 V

Technical details

P-channel 30V MOSFET in SOIC-8 — load-switch fit

Gate charge is 14nC at 10V, which keeps the switching driver load modest at moderate frequencies.

Rds(on) is specified at 59mOhm max with Vgs=10V and Id=5.4A. That 59mOhm figure is the conduction-loss anchor for a 5A load — expect about 1.5W dissipation at full current before derating. The gate charge of 14nC at 10V means a gate driver sourcing 1A can switch the FET in roughly 14ns, though the practical edge rate is limited by the gate-driver loop inductance and the 386pF input capacitance at 25V Vds.

Thermal envelope and package reality

The 2.5W power dissipation at 25°C ambient is the package-limited ceiling in free air — a 5.4A load at full Rds(on) pushes 1.5W, leaving 1W of thermal headroom before hitting the 150°C junction limit. The SOIC-8 body (0.154-inch width) is a standard footprint; the 8-SO supplier device package matches the common SO-8 land pattern.

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