IRF7607TRPBF

Infineon Technologies

Infineon Technologies HEXFET® N-Channel MOSFET, IRF7607TRPBF, 20 V, 6.5 A, 30 mOhm Rds(on) @ 4.5 V, 22 nC gate charge, -55 to 150°C, surface mount, bulk.

Infineon Technologies IRF7607TRPBF
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Technical specifications

IRF7607TRPBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®
FET typeN-Channel
MountingSurface Mount
Operating temperature high-55°C to 150°C(TJ)
Vgs±12 V
Power1.8
Package_typeBulk
Capacitance_uf0.0013
StatusActive
Supply voltage20.0
Vgs(Th) (Max) @ id1.2 V @ 250µA
Switching current6.5
Rds on (Max) @ id, vgs30mOhm @ 6.5 A, 4.5 V
Gate charge (Qg) (Max) @ vgs22 nC @ 5 V

Technical details

Rds(on) at junction temperature, not 25°C

The IRF7607TRPBF is an Infineon N-channel HEXFET MOSFET rated for 20 V drain-source and 6.5 A continuous drain current. The headline Rds(on) of 30 mOhm at 6.5 A and 4.5 V is specified at 25°C junction — at 150°C junction the on-resistance roughly doubles, so a 12 V rail converter delivering 4 A continuous should budget ~60 mOhm hot resistance for the conduction loss calculation.

Gate charge and switching loss

Total gate charge Qg is 22 nC at 5 V Vgs. For a 200 kHz buck converter, the gate-drive power is roughly Qg × Vgs × fsw = 22 nC × 5 V × 200 kHz = 22 mW — well within a standard 1 A gate driver's capability. The 1.3 nF output capacitance (Coss) keeps the switching node capacitance low, reducing turn-on loss in hard-switched topologies.

Logic-level threshold and gate-drive compatibility

The ±12 V Vgs absolute maximum means a 5 V gate signal has 7 V of margin before the oxide sees stress — safe for any standard gate driver output. The 1.8 W power dissipation at 25°C ambient sets the thermal budget; a 4 A load at 60 mOhm hot Rds(on) dissipates ~1 W, leaving margin for ambient temperatures up to 85°C with adequate copper area on the PCB.

The IRF7607TRPBF is the bulk-pack variant of the IRF7607; the tape-and-reel version uses a different suffix.

IRF7607TRPBF
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