IRF7343TRPBF

Infineon Technologies · HEXFET® Series

IRF7343TRPBF, HEXFET series, complementary N and P-Channel MOSFET, 55V drain-to-source voltage, 4.7A/3.4A continuous drain current, 50mOhm Rds(on) at 10V, SO-8 package, -55°C to 150°C operating temperature.

Infineon Technologies IRF7343TRPBF
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

IRF7343TRPBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®
MountingSurface Mount
Drain to source voltage55V
Current - continuous drain (Id) @ 25°C4.7A, 3.4A
Power - max2W
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
TechnologyMOSFET (Metal Oxide)
ConfigurationN and P-Channel
Case8-SOIC (0.154\", 3.90mm Width)
Vgs(th) (Max) @ id1V @ 250µA
Rds on (Max) @ id, vgs50mOhm @ 4.7A, 10V
Gate charge (Qg) (Max) @ vgs36nC @ 10V
Input capacitance (Ciss) (Max) @ vds740pF @ 25V

Technical details

Complementary N/P-channel in one SO-8

The IRF7343TRPBF integrates an N-channel and a P-channel MOSFET in a single 8-SOIC package, rated for a drain-to-source voltage of 55 V. The N-channel side handles 4.7 A continuous drain current; the P-channel side is rated at 3.4 A. On-resistance is 50 mOhm maximum for the N-channel at Vgs = 10 V and 4.7 A. This dual configuration lets one device replace two separate MOSFETs in half-bridge topologies, synchronous rectifier stages, or bidirectional load switches — cutting component count and PCB area.

Thermal budget in SO-8

Maximum power dissipation is 2 W in the SO-8 package. That 2 W ceiling sets the practical continuous current well below the 4.7 A / 3.4 A ratings unless the board provides generous copper area on the drain pads. For a 55 V rail, the Rds(on) at elevated junction temperature rises roughly 50 % above the 25 °C value — factor that into the thermal loop when sizing the load.

The gate charge is moderate — a standard 1 A gate driver can switch the pair at 100–200 kHz without excessive drive loss.

IRF7343TRPBF
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