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Infineon Technologies IRF7105TRPBF

IRF7105TRPBF HEXFET® N/P-Channel MOSFET, 25V 3.5A/2.3A

MPNIRF7105TRPBF
End of Life

Infineon HEXFET® series, IRF7105TRPBF, complementary N and P-Channel MOSFET, 25V Drain to Source Voltage, 3.5A/2.3A Continuous Drain Current, 100mOhm Rds(on) at 10V, 27nC Gate Charge, 8-SOIC package, -55°C to 150°C.

$0.72Ref. price · indicative, final on quote
Packaging8-SOIC (0.154", 3.90mm Width)
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

IRF7105TRPBF Technical Specifications
ParameterValue
SeriesHEXFET®
FET typeN and P-Channel
Mounting typeSurface Mount
Drain to source voltage25V
Current - continuous drain (Id) @ 25°C3.5A, 2.3A
Power - max2W
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
FET featureStandard
Case8-SOIC (0.154\", 3.90mm Width)
Vgs(th) (Max) @ id3V @ 250µA
Rds on (Max) @ id, vgs100mOhm @ 1A, 10V
Gate charge (Qg) (Max) @ vgs27nC @ 10V
Input capacitance (Ciss) (Max) @ vds330pF @ 15V

Product details

Complementary N/P-channel pair in a single SO-8

The IRF7105TRPBF from Infineon's HEXFET® series integrates an N-channel and a P-channel MOSFET in one 8-SOIC package, rated for 25 V drain-to-source voltage with continuous drain currents of 3.5 A (N-channel) and 2.3 A (P-channel) at 25 °C.

Conduction and switching parametrics for the half-bridge

Total gate charge is 27 nC at 10 V, which means a 1 A gate driver can switch this pair at roughly 37 MHz before the drive current becomes the limiting factor — for practical 100–500 kHz power stages the gate-drive loss is negligible. Input capacitance is 330 pF at 15 V Vds, a moderate figure that keeps the switching node ringing manageable without excessive snubbing on a well-laid-out 4-layer board.

Package and temperature grade for the environment

The 8-SOIC (0.154-inch width) package is a surface-mount footprint with a 2 W maximum power dissipation — the copper pad area under the die sets the thermal resistance, so a solid ground plane pour is expected for continuous operation above 1 A.

Frequently asked questions

Can IRF7105TRPBF replace IRF7105PBF?

The IRF7105TRPBF is the Tape & Reel variant of the same die and package as the IRF7105PBF (which ships in tube). Electrically they are identical — the suffix difference is packaging only.