IRF6648TRPBF

Infineon Technologies · HEXFET® Series

Infineon HEXFET IRF6648TRPBF, N-Channel MOSFET, 60 V Vdss, 86 A continuous drain (Tc), 7 mOhm Rds(on) at 17 A, 10 V, DirectFET Isometric MN package, -40°C to 150°C junction temperature.

Infineon Technologies IRF6648TRPBF
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[IN STOCK] In Stock: 100 pcs
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

IRF6648TRPBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®
FET typeN-Channel
MountingSurface Mount
Drain to source voltage60 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C86A (Tc)
Power dissipation2.8W (Ta), 89W (Tc)
Operating temperature-40°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseDirectFET™ Isometric MN
Vgs(th) (Max) @ id4.9V @ 150µA
Rds on (Max) @ id, vgs7mOhm @ 17A, 10V
Gate charge (Qg) (Max) @ vgs50 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds2120 pF @ 25 V

Technical details

Total gate charge is 50 nC at 10 V, which translates to a 10 mA average gate-drive current at 200 kHz switching frequency — a standard gate-driver IC handles that without thermal stress. Input capacitance is 2120 pF at 25 V drain-source, so the driver's peak current must charge that capacitance within the desired dead-time window.

DirectFET MN footprint and thermal path

The DirectFET Isometric MN package is a solderable-can surface-mount package; the drain tab on the top of the can conducts heat into the PCB copper plane. The land pattern for DirectFET MN is specific — the PCB footprint must match the MN outline to get the rated 89 W power dissipation at the case. The 2.8 W at ambient reflects the free-air derating without a heatsink.

The 150°C TJ(max) gives headroom for surge currents and high ambient temperatures.

IRF6648TRPBF
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