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Infineon Technologies IRF40DM229 — Discrete Semiconductors

IRF40DM229 N-Channel MOSFET, 40V 159A, 1.85 mOhm Rds(on)

MPNIRF40DM229
Active

Infineon StrongIRFET™ IRF40DM229 N-Channel MOSFET, 40 V, 159 A, 1.85 mOhm Rds(on) at 10 V, 161 nC Qg, DIRECTFET package, -55 to 150 °C junction.

$1.11Ref. price · indicative, final on quote
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MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
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Specifications

IRF40DM229 Technical Specifications
ParameterValue
SeriesStrongIRFET™
FET typeN-Channel
Mounting_typeSurface Mount
Operating temperature high-55°C to 150°C(TJ)
Vgs±20 V
Power_w83.0
Package_typeBulk
Capacitance_uf0.0053
Product_statusActive
Supply_voltage_v40.0
Vgs(Th) (Max) @ id3.9 V @ 100µA
Switching_current_a159.0
Rds on (Max) @ id, vgs1.85mOhm @ 97 A, 10 V
Gate charge (Qg) (Max) @ vgs161 nC @ 10 V

Product details

40 V, 1.85 mOhm — the conduction-loss floor

The Infineon IRF40DM229 is an N-Channel StrongIRFET™ MOSFET rated at 40 V drain-source and 159 A continuous drain current. The headline figure is the 1.85 mOhm maximum on-resistance at 97 A, 10 V gate drive — this sets the conduction-loss floor for a high-current switching design. At 100 A, that is about 18.5 W of I²R loss before accounting for temperature derating.

Gate charge and switching speed

Total gate charge is 161 nC at Vgs = 10 V. For a 1 A gate driver, that translates to roughly 160 ns to charge the gate to the Miller plateau. The ±20 V maximum gate-source rating gives headroom for gate-drive overshoot in hard-switching topologies.

Thermal and package reality

Junction temperature range is -55 to 150 °C, covering industrial and automotive under-hood environments. The DIRECTFET package is a surface-mount can with a large exposed drain pad on the bottom — the thermal path runs through the PCB copper, so the board layout and via count directly set the effective RthJA. 83 W maximum power dissipation assumes an infinite heatsink; real-world derating depends on the board's ability to sink heat.

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