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Infineon Technologies IRF3805STRLPBF

IRF3805STRLPBF N-Channel MOSFET, 55V 75A D2PAK, 3.3 mOhm

MPNIRF3805STRLPBF
End of Life

Infineon HEXFET N-Channel MOSFET, IRF3805STRLPBF, 55 V Vdss, 75 A continuous drain, 3.3 mOhm Rds(on) at 10 V, D2PAK surface mount, -55°C to 175°C junction temperature.

$4.26Ref. price · indicative, final on quote
PackagingTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

IRF3805STRLPBF Technical Specifications
ParameterValue
SeriesHEXFET®
FET typeN-Channel
Mounting typeSurface Mount
Drain to source voltage55 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C75A (Tc)
Power dissipation300W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Vgs(th) (Max) @ id4V @ 250µA
Rds on (Max) @ id, vgs3.3mOhm @ 75A, 10V
Gate charge (Qg) (Max) @ vgs290 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds7960 pF @ 25 V

Product details

3.3 mOhm at 75 A — the conduction-loss floor

The headline figure is the 3.3 mOhm maximum on-resistance at Vgs=10 V and 75 A — this sets the conduction-loss floor for a high-current switching stage. At 75 A, I²R losses sit at roughly 18.6 W, which the 300 W package dissipation can handle with adequate heatsinking.

290 nC gate charge — driver selection matters

Gate charge totals 290 nC at Vgs=10 V. That is a heavy load for a gate driver — expect to budget a driver capable of sourcing at least 2 A peak to keep switching transitions under 150 ns. The 7960 pF input capacitance at Vds=25 V reinforces the same point: the driver sees a large capacitive load, and rise/fall times will be dominated by the driver's current capability.

D2PAK footprint and thermal path

Surface-mount in the TO-263-3 (D²Pak) package, the tab is the drain terminal and the primary thermal path. The 300 W dissipation rating assumes the tab is soldered to a copper plane of adequate area — a 1 oz copper pad of at least 25 mm x 25 mm on a 2-layer board gets you into the 40-50 °C/W RthJA range. The ±20 V maximum gate-source rating is generous, but the 4 V threshold at 250 µA means a 10 V gate drive is needed to achieve the rated Rds(on).

Frequently asked questions

What is the difference between IRF3805STRLPBF and IRF3805PBF?

The die and electrical ratings are identical. IRF3805STRLPBF ships in Tape & Reel packaging; IRF3805PBF ships in tube packaging. Choose the reel for automated pick-and-place assembly, the tube for bench or low-volume builds.