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Infineon Technologies IRF3710ZSTRLPBF

IRF3710ZSTRLPBF N-Channel MOSFET, 100 V, 59 A, 18 mOhm

MPNIRF3710ZSTRLPBF
End of Life

Infineon HEXFET IRF3710ZSTRLPBF, N-Channel MOSFET, 100 V Vdss, 59 A Id, 18 mOhm Rds(on) at 10 V, D2PAK (TO-263), -55 to 175 °C.

$1.88Ref. price · indicative, final on quote
PackagingTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

IRF3710ZSTRLPBF Technical Specifications
ParameterValue
SeriesHEXFET®
FET typeN-Channel
Mounting typeSurface Mount
Drain to source voltage100 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C59A (Tc)
Power dissipation160W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Vgs(th) (Max) @ id4V @ 250µA
Rds on (Max) @ id, vgs18mOhm @ 35A, 10V
Gate charge (Qg) (Max) @ vgs120 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds2900 pF @ 25 V

Product details

Package and mounting

The 160 W power dissipation rating at the case tells you the thermal design needs a solid thermal pad and via array under the tab to keep junction temperature below the 175 °C absolute maximum.

Gate charge and switching — sizing the driver

Total gate charge is 120 nC at 10 V. At a 100 kHz switching frequency, the average gate drive current needed is 12 mA — well within a typical MOSFET driver's capability, but the peak current from the driver must handle the gate capacitance charging in the transition time. The 2900 pF input capacitance at 25 V drain-source confirms the gate is not excessively large; a standard 1 A to 2 A gate driver will switch this part cleanly in a hard-switching topology.

Package and mounting

Surface-mount D2PAK (TO-263-3) with two leads and a tab. Preheating the board to 125 °C before hot-air removal prevents the tab from wicking heat away and cracking the solder joint on the opposite side. The tab's thermal mass means a standard hot-air station at 350 °C with a 10 mm nozzle will lift the part cleanly if the board is preheated; without preheat, expect to chase a cold joint on the tab.

Frequently asked questions

Can IRF3710ZSTRLPBF replace IRF3710?

The IRF3710ZSTRLPBF is a surface-mount D2PAK variant of the IRF3710 family. The IRF3710 is typically a through-hole TO-220 package; the die and ratings are similar, but the package footprint and thermal interface differ. Confirm the PCB pad layout and thermal design before substituting.

Is IRF3710ZSTRLPBF lead-free?

The part is ROHS3 compliant, meaning it meets the lead-free and restricted-substance requirements of the ROHS directive.