75 V, 160 A N-channel HEXFET for high-current switching
The IRF2907ZSTRLPBF: The D2PAK (TO-263) surface-mount package with its large exposed tab lets the PCB copper plane serve as the primary heatsink, but at 300 W maximum dissipation the thermal path from tab to board area needs careful layout attention.
Gate charge and drive requirements
The total gate charge is 270 nC at 10 V. The input capacitance is 7500 pF at 25 V drain bias.
Package and PCB thermal design
The D2PAK (TO-263-3) package has two leads plus the drain tab. The large copper tab is the primary thermal path — the PCB copper area under the tab sets the junction-to-ambient thermal resistance.