75 V, 160 A N-channel HEXFET for high-current switching
The IRF2907ZSTRLPBF: The D2PAK (TO-263) surface-mount package with its large exposed tab lets the PCB copper plane serve as the primary heatsink, but at 300 W maximum dissipation the thermal path from tab to board area needs careful layout attention.
Gate charge and drive requirements
The total gate charge is 270 nC at 10 V.
Package and PCB thermal design
The D2PAK (TO-263-3) package has two leads plus the drain tab.
