IRF2907ZPBF

Infineon Technologies · HEXFET® Series

IRF2907ZPBF, HEXFET series, N-channel MOSFET, 75 V Vdss, 160 A Id, 4.5 mOhm Rds(on) at 10 V, 270 nC Qg, TO-220AB package, -55 to 175 °C.

Infineon Technologies IRF2907ZPBF
[IN STOCK] In Stock: 292 pcs
$2.70/ pc

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Technical specifications

IRF2907ZPBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®
FET typeN-Channel
MountingThrough Hole
Drain to source voltage75 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C160A (Tc)
Power dissipation300W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTube
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-220-3
Vgs(th) (Max) @ id4V @ 250µA
Rds on (Max) @ id, vgs4.5mOhm @ 75A, 10V
Gate charge (Qg) (Max) @ vgs270 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds7500 pF @ 25 V

Technical details

Through-hole power MOSFET for high-current switching

Operating junction temperature spans -55 to 175 °C, suiting it for industrial and automotive environments where the thermal cycling is aggressive.

Total gate charge is 270 nC at 10 V — a standard 1 A gate driver will take roughly 270 ns to switch the FET, so plan for a driver with at least 2 A peak source/sink capability if the target switching frequency exceeds 20 kHz.

The TO-220AB package has a metal tab that is electrically common with the drain — the PCB or heatsink pad must be isolated or the system must tolerate the drain potential on the heatsink. Maximum power dissipation is 300 W at case temperature, but the real thermal limit depends on the heatsink's thermal resistance; a 1 °C/W heatsink keeps the junction below 175 °C at 100 W dissipation.

IRF2907ZPBF
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