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Infineon Technologies IRF225 — Discrete Semiconductors

IRF225 N-Channel MOSFET, 250 V, 3.3 A, 40 W, TO-3 Hermetic

MPNIRF225
Active

IRF225, N-Channel Hermetic MOS HEXFET, 250 V drain-source voltage, 3.3 A continuous drain current, 40 W power dissipation, Through Hole TO-3 package, Active lifecycle.

$2.00Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

IRF225 Technical Specifications
ParameterValue
FET typeN-Channel
Mounting_typeThrough Hole
Power_w40.0
Package_typeBulk
Product_statusActive
Supply_voltage_v250.0
Switching_current_a3.3

Product details

Hermetic N-Channel HEXFET for High-Reliability Power Switching

The IRF225 is an N-Channel enhancement-mode power MOSFET built on the HEXFET structure, housed in a hermetic TO-3 package. It is rated for a drain-source voltage of 250 V, continuous drain current of 3.3 A, and power dissipation of 40 W. The hermetic TO-3 package seals the die against moisture and contamination, making this part suited for military, aerospace, and downhole environments where standard plastic-packaged MOSFETs would fail from corrosion or outgassing.

250 V / 3.3 A — Thermal and Load Budget

The 250 V drain-source rating provides headroom for a 170 VDC or 120 VAC rectified bus in motor drives, inverters, and switch-mode power supplies. The 3.3 A continuous current is the DC limit at case temperature; actual usable current derates with junction temperature per the datasheet's SOA curve. With a 40 W power dissipation ceiling, the thermal design must keep the case-to-ambient resistance low — a TO-3 bolted to a heatsink with thermal compound typically achieves 1–2 °C/W junction-to-case. Budget the heatsink area for the worst-case conduction loss at 3.3 A and the switching loss at the target frequency.

Through-Hole Mounting in the TO-3 Base

The through-hole mounting uses two 0.160-inch mounting holes on a 1.187-inch bolt circle, standard for TO-3. The collector (drain) tab is the case itself — the heatsink must be electrically isolated or the system ground must reference the drain potential.

Frequently asked questions

What is IRF225?

Identifies the part and its basic function as an N-Channel power MOSFET.

Where can I download the IRF225 datasheet?

Engineers need the datasheet for pinout, electrical characteristics, and thermal data.

Is IRF225 obsolete?

Buyers need lifecycle status to avoid supply chain disruptions.

What is the IRF225 equivalent?

Cross-reference helps find drop-in or functional replacements for sourcing flexibility.

Where to buy IRF225?

Sourcing buyers need distributor availability and lead time to fulfill BOM.

What is the IRF225 price?

Cost data is critical for budgeting and procurement decisions.