Skip to main content
Infineon Technologies IRF1010ESTRLPBF

IRF1010ESTRLPBF HEXFET N-Channel MOSFET, 60V 84A D2PAK

MPNIRF1010ESTRLPBF
End of Life

Infineon HEXFET® series, IRF1010ESTRLPBF, N-Channel MOSFET, 60V Vdss, 84A Id, 12mOhm Rds(on) at 10V, 130nC Qg, D2PAK surface mount, -55°C to 175°C.

$1.63Ref. price · indicative, final on quote
PackagingTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

IRF1010ESTRLPBF Technical Specifications
ParameterValue
SeriesHEXFET®
FET typeN-Channel
Mounting typeSurface Mount
Drain to source voltage60 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C84A (Tc)
Power dissipation200W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Vgs(th) (Max) @ id4V @ 250µA
Rds on (Max) @ id, vgs12mOhm @ 50A, 10V
Gate charge (Qg) (Max) @ vgs130 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds3210 pF @ 25 V

Product details

60V, 84A N-channel HEXFET in D2PAK

The Infineon IRF1010ESTRLPBF is a 60V, 84A N-channel power MOSFET from the HEXFET series, housed in a D2PAK (TO-263) surface-mount package. It is designed for high-current switching applications where low on-resistance and fast switching are required.

Rds(on) of 12 mOhm at 50A, 10V sets the conduction loss floor at 30W (I²R) at full rated current — the D2PAK package with its exposed tab can sink that into a copper plane if the PCB layout provides a low-thermal-resistance path. Total gate charge of 130 nC at 10V means the gate driver must supply 130 nC per switching event. At 100 kHz switching frequency, that is 13 mA average drive current — within the capability of most dedicated MOSFET gate drivers, but a factor to check when using a microcontroller GPIO directly. Input capacitance Ciss of 3210 pF at 25V Vds contributes to the Miller plateau duration; the driver's peak current capability determines the actual turn-on and turn-off delay, so pair this MOSFET with a driver rated for at least 2A peak to keep switching edges clean.

Temperature grade and deployment envelope

The 200W power dissipation at case temperature (Tc) is a package-limited rating; actual usable dissipation depends on the PCB copper area and airflow. The D2PAK's exposed drain tab should be soldered to a large copper pour for thermal relief.

Sourcing and lifecycle posture

ROHS3 compliant, it is suitable for new designs requiring a lead-free, RoHS-compliant bill of materials. The D2PAK footprint is shared across the HEXFET family, so a board layout designed for this part can accommodate other 60V N-channel D2PAK devices from the same series.

Frequently asked questions

What is the Rds(on) of IRF1010ESTRLPBF at 10V gate drive?

The maximum Rds(on) is 12 mOhm at 50A drain current with 10V gate-to-source voltage. This is the conduction loss floor for high-current switching applications.

What is the maximum junction temperature for IRF1010ESTRLPBF?

The operating junction temperature range is -55°C to 175°C, covering military and industrial thermal environments.