Temperature grade and package — where it goes
Rated for a junction temperature range of -40°C to 150°C, the IR2010PBF is suited for industrial and automotive environments — motor drives in factory automation, PFC stages in power supplies, or under-hood power modules. The 14-DIP through-hole package is a through-hole footprint, which matters for legacy board layouts, socketed prototyping, or designs where hand-solderability is preferred over reflow. The supplier device package is also 14-DIP.
Lifecycle and sourcing — active, no LTB risk
The IR2010PBF carries an Active product status and is ROHS3 compliant.
