Thermal performance and power dissipation
The IPTC019N10NM5ATMA1: Maximum power dissipation is 300 W at case temperature (Tc) and 3.8 W at ambient (Ta) — the package thermal path is the limiter. To approach the 279 A continuous drain rating, a large heatsink or forced air is required to keep the junction below 175 °C. The 175 °C maximum junction temperature allows operation in high-ambient environments like engine bays or industrial enclosures without premature derating. The operating temperature range is -55 °C to 175 °C.
Package and mounting
The device is supplied in a 16-PowerSOP Module package, supplier package code PG-HDSOP-16-2. It is surface-mount only. The exposed pad must be soldered to a thermal land on the PCB for effective heat transfer. The package accepts Tape & Reel (TR) or Cut Tape (CT) shipping formats.
Lifecycle and compliance
Infineon lists the IPTC019N10NM5ATMA1 as Active — no last-time-buy risk for new designs. It is ROHS3 compliant, with no lead exemptions. The series is OptiMOS 5, Infineon's 5th-generation trench MOSFET platform.