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Infineon Technologies IPT60R150G7XTMA1

Infineon IPT60R150G7XTMA1 CoolMOS G7 N-Ch 650V 17A MOSFET

MPNIPT60R150G7XTMA1
End of Life

Infineon CoolMOS™ G7 series, N-Channel MOSFET, 650 V Drain-Source Voltage, 17 A Continuous Drain Current, 150 mOhm On-Resistance @ 10V, PG-HSOF-8-2 Package, -55°C to 150°C Operating Temperature.

$5.04Ref. price · indicative, final on quote
Infineon Technologies IPT60R150G7XTMA1 datasheet (PDF)
Packaging8-PowerSFN
RoHSROHS3 Compliant
SeriesCoolMOS™ G7
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

IPT60R150G7XTMA1 specifications
ParameterValue
SeriesCoolMOS™ G7
FET typeN-Channel
MountingSurface Mount
Drain to source voltage650 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C17A (Tc)
Power dissipation106W (Tc)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
Case8-PowerSFN
Vgs(th) (Max) @ id4V @ 260µA
Rds on (Max) @ id, vgs150mOhm @ 5.3A, 10V
Gate charge (Qg) (Max) @ vgs23 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds902 pF @ 400 V

Product details

It is a high-voltage switching device built for power conversion stages where low conduction and fast switching both matter. The 150 mOhm on-resistance at 5.3 A and 10 V increases with junction temperature. A standard driver handles the load.

Switching and thermal — the parametric picture

Input capacitance is 902 pF at 400 V drain-source. That is a moderate figure — the driver sees a manageable capacitive load at turn-on, and the miller plateau stays short enough for clean edge rates in hard-switched topologies like PFC or LLC. Power dissipation is rated at 106 W at the case.

ROHS3 compliant — no exemptions for lead in solder or other restricted substances, which simplifies compliance for EU and global markets.

Package and footprint — what the PG-HSOF-8-2 needs

Frequently asked questions

Can I swap this MOSFET on site with basic tools?

The PG-HSOF-8-2 is a surface-mount package with an exposed pad. Swapping it on site without a hot-air rework station or a temperature-controlled soldering iron with a large tip is risky — the pad needs uniform heat to reflow the solder underneath. Not a field-swap part unless you carry a hot-air station in the kit.