Package and thermal handling
The IPT60R050G7XTMA1: Housed in an 8-PowerSFN (PG-HSOF-8-2) surface-mount package, this MOSFET relies on the PCB copper and thermal vias to pull heat from the exposed pad. The 245 W power dissipation rating at case temperature assumes a well-designed thermal path — expect to allocate a dedicated copper island under the part and a via array to the inner or backside plane. No lab bench needed for the swap, but the board layout has to be right from the start.
Lifecycle and sourcing
Listed as Active in production with ROHS3 compliance.
Where it fits
Targets the 600 V class of power conversion: server and telecom PSUs, solar inverters, EV onboard chargers, and industrial motor drives.
