Gate charge and drive — what 27 nC means for the BOM
It keeps the gate-drive energy per switching cycle low.
Package and mounting — TO-220-3 through-hole
The IPP60R600CP is supplied in the through-hole TO-220-3 package, Infineon code PG-TO220-3-1. The three-lead vertical-mount form factor is the standard for heatsink-clip or screw-mount attachment on a PCB or chassis. The metal tab is the drain. For thermal design, the maximum power dissipation is 60 W at the case temperature, but the actual allowable dissipation depends on heatsink thermal resistance and ambient conditions — derate per the thermal impedance curve in the datasheet.
It is ROHS3 compliant.
