SOT223 thermal reality — plan the copper area
The PG-SOT223 package dissipates 7 W maximum at the case. That figure assumes adequate PCB copper for heat spreading; a design pulling 4 A continuous will need a thermal via pattern and a reasonable copper pour on the drain tab. The 250 pF input capacitance at 500 V drain bias is low enough that a standard gate-drive IC can switch it without excessive cross-conduction.
Active production — no LTB clock ticking
Infineon lists the IPN80R1K4P7ATMA1 as Active with ROHS3 compliance. No last-time-buy notice is in effect, so the part is safe to qualify for new BOM lines.
