The IPI65R310CFDXKSA1700: The TO-262-3 through-hole package (PG-TO262-3-1) suits designs where a heatsink is bolted directly to the tab.
Temperature range and dissipation — sizing the thermal path
Maximum power dissipation is 104.2 W at case temperature — a figure that assumes an ideal heatsink; real designs need the thermal resistance from junction to case (not listed here) to size the heatsink. The 1100 pF input capacitance at 100 V drain-source gives a first-order estimate of the gate-drive current required at the target switching frequency.
