Dual N-channel 40 V MOSFET for automotive and industrial loads
Thermal and switching characteristics for harsh environments
Maximum power dissipation is 26 W at case temperature, which sets the thermal design constraint for the PCB copper area and heatsinking.
Package and mounting for automated assembly
Housed in an 8-lead PowerVDFN package (PG-TDSON-8-10) with wettable flanks, the part supports automated optical inspection (AOI) of solder joints — a requirement for automotive production lines. Surface-mount assembly with wettable flanks improves solder-joint reliability under vibration and thermal cycling compared to standard flat-lead packages.
ROHS3 compliant, with no known PCN or EOL activity at the time of writing.
