Mounting and package note
The IPD60R380P6ATMA1: The PG-TO252-3 (DPak) surface-mount package has a large drain tab soldered to the PCB pad — the tab is the drain connection, so the PCB copper plane doubles as the thermal path. Layout must keep the tab pad connected to a sufficient copper area (typically 3–6 cm² per side) to keep junction rise within limits at 10 A continuous.
For BOM planning, the CoolMOS™ P6 family has broad cross-reference coverage; if allocation hits a specific Rds(on) bin, a same-package sibling within the 600 V P6 family is a drop-in candidate as long as the Rds(on) and current ratings meet the design margin.
