Skip to main content
Infineon Technologies IPD60R2K0C6ATMA1
Infineon Technologies

IPD60R2K0C6ATMA1 CoolMOS C6 N-Ch 600V 2.4A TO252-3

MPNIPD60R2K0C6ATMA1
End of Life

Infineon CoolMOS™ C6 series, IPD60R2K0C6ATMA1, N-Channel MOSFET, 600 V Vdss, 2.4 A continuous drain, 2 Ohm Rds(on) at 10 V, PG-TO252-3 package, -55 to 150 °C junction.

$0.89Ref. price · indicative, final on quote
IPD60R2K0C6ATMA1 datasheet
PackagingTO-252-3, DPak (2 Leads + Tab), SC-63
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

IPD60R2K0C6ATMA1 Technical Specifications
ParameterValue
SeriesCoolMOS™ C6
FET typeN-Channel
Mounting typeSurface Mount
Drain to source voltage600 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C2.4A (Tc)
Power dissipation22.3W (Tc)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-252-3, DPak (2 Leads + Tab), SC-63
Vgs(th) (Max) @ id3.5V @ 60µA
Rds on (Max) @ id, vgs2Ohm @ 760mA, 10V
Gate charge (Qg) (Max) @ vgs6.7 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds140 pF @ 100 V

Product details

600 V N-channel in a TO252-3 — primary-side flyback fit

The 2 Ohm maximum on-resistance at 760 mA and 10 V gate drive defines the conduction loss floor in a typical offline flyback primary switch. Gate charge totals 6.7 nC at 10 V, so the driver sees a light capacitive load — a small-signal gate driver or a PWM controller totem-pole can drive it without a dedicated buffer.

The 2 Ohm Rds(on) at 760 mA is specified at 10 V gate drive. At 2.4 A continuous drain the conduction loss is I²R = 11.5 W, which eats into the 22.3 W power dissipation limit — derating is required above 25 °C.

Package and mounting — TO252-3 surface-mount

The PG-TO252-3 (DPak) package has a tab that carries the drain connection; the copper area on the PCB under the tab sets the thermal resistance. Surface-mount assembly with standard reflow profiles — no special handling beyond normal MSL precautions.