Package and mounting — PG-TO252-3
The IPD110N12N3GATMA1: Housed in the PG-TO252-3 (DPak) surface-mount package, this part has two leads plus a tab that carries the drain current. The tab is the primary thermal path — board layout should connect it to a copper plane for heat spreading. The supplier device package code PG-TO252-3 is Infineon's variant; it is footprint-compatible with standard TO-252 land patterns. Mounting type is surface mount, so reflow or vapor-phase soldering is the assembly method.
Lifecycle and compliance
No last-time-buy or end-of-life notice is in effect. ROHS3 compliant, and the Vgs maximum of ±20 V gives margin for gate-drive overshoot in noisy environments.
