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Infineon Technologies IPA90R340C3XKSA2 — Discrete Semiconductors

Infineon IPA90R340C3XKSA2 CoolMOS N-Ch 900V 15A TO-220FP

MPNIPA90R340C3XKSA2
Active

Infineon CoolMOS™ C3 series, N-channel MOSFET, 900V Vdss, 15A continuous drain, 340mOhm Rds(on), TO-220-3 Full Pack (PG-TO220-FP), through-hole, ROHS3 compliant.

$5.5400Ref. price · indicative, final on quote
PackagingTO-220-3 Full Pack
RoHSROHS3 Compliant
SeriesCoolMOS™
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

IPA90R340C3XKSA2 specifications
ParameterValue
SeriesCoolMOS™
FET typeN-Channel
MountingThrough Hole
Drain to source voltage900 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C15A (Tc)
Power dissipation35W (Tc)
Operating temperature-55°C ~ 150°C (TJ)
PackageTube
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-220-3 Full Pack
Vgs(th) (Max) @ id3.5V @ 1mA
Rds on (Max) @ id, vgs340mOhm @ 9.2A, 10V
Gate charge (Qg) (Max) @ vgs94 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds2400 pF @ 100 V

Product details

900V, 15A, 340mOhm — the C3 switching-loss profile

The IPA90R340C3XKSA2: The 94nC total gate charge and 2400pF input capacitance at 100V Vds define the switching energy per cycle — at a 100kHz hard-switched frequency, the gate drive current needed is about 9.4mA average, and the capacitive turn-on loss scales with Coss. This part is sized for the 100-300W range in flyback, PFC, or LLC converters where 900V margin covers universal AC input with derating.

TO-220 Full Pack — isolated tab, no pad needed

The PG-TO220-FP (full-pack) package has a fully isolated backside tab — no insulating pad or washer is required between the device and the heatsink. This simplifies assembly in through-hole designs and eliminates the thermal interface gap that a pad introduces. Maximum power dissipation is 35W at case temperature, and the junction range spans -55°C to 150°C, covering industrial ambient environments. The through-hole mounting suits single-sided or double-sided boards where the heatsink attaches directly to the chassis or a dedicated heatsink.