Package and mounting — the TO-247-4 advantage
The TO-247-4 package (supplier device code PG-TO247-4-3) is a through-hole footprint with four pins: gate, Kelvin source, drain, and power source. The Kelvin source pin lets the gate-drive return connect directly to the source sense point inside the package, bypassing the common-source inductance that plagues standard TO-247-3 layouts. For a SiC MOSFET switching at high di/dt, this pin can mean the difference between a clean gate waveform and oscillation. Mounting is standard through-hole on a TO-247 footprint — the fourth pin sits between the gate and the existing source pin, so the PCB layout needs a small adjustment from a three-pin pattern.
Lifecycle and sourcing reality
The IMZA65R027M1HXKSA1 carries an Active product status — no end-of-life notice, no last-time-buy window. It is ROHS3 compliant. For current-production designs this part can be specified into the BOM without near-term obsolescence risk.
