IMZ120R060M1HXKSA1

Infineon Technologies · CoolSiC™ Series

Infineon CoolSiC™ series, IMZ120R060M1HXKSA1, N-Channel SiCFET, 1200 V Vdss, 36 A Id, 78 mOhm Rds(on) at 18 V, TO-247-4 package, -55°C to 175°C junction temperature.

Infineon Technologies IMZ120R060M1HXKSA1
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Technical specifications

IMZ120R060M1HXKSA1 specifications
Parameter / AttributeSpecification / Value
SeriesCoolSiC™
FET typeN-Channel
MountingThrough Hole
Drain to source voltage1200 V
Drive voltage (Max rds on, min rds on)15V, 18V
Current - continuous drain (Id) @ 25°C36A (Tc)
Power dissipation150W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTube
Vgs+23V, -7V
TechnologySiCFET (Silicon Carbide)
CaseTO-247-4
Vgs(th) (Max) @ id5.7V @ 5.6mA
Rds on (Max) @ id, vgs78mOhm @ 13A, 18V
Gate charge (Qg) (Max) @ vgs31 nC @ 18 V
Input capacitance (Ciss) (Max) @ vds1060 pF @ 800 V

Technical details

This is a through-hole device in the TO-247-4 package (PG-TO247-4-1), which adds a dedicated Kelvin-source pin to decouple the gate-drive loop from the power path — a feature that reduces switching losses and gate ringing in hard-switched topologies. The 78 mOhm maximum on-resistance at 18 V gate drive and 13 A sets the conduction-loss baseline for efficiency calculations in high-voltage DC-DC, on-board charger, and traction-inverter designs.

Gate drive and switching — 31 nC Qg at 18 V

The device specifies a gate-charge maximum of 31 nC at 18 V, which is moderate for a 1.2 kV SiC FET and keeps driver losses manageable. The recommended drive voltage range for achieving the rated Rds(on) is 15 V to 18 V; the absolute maximum gate-source voltage is +23 V and -7 V. The gate-threshold maximum is 5.7 V at 5.6 mA, so a standard +15 V / -5 V gate drive is well within the safe operating window. Input capacitance is 1060 pF at 800 V Vds, giving a moderate switching speed that simplifies layout parasitics.

Package and thermal — TO-247-4 with Kelvin source

The TO-247-4 package (PG-TO247-4-1) is a through-hole, 4-pin variant. The fourth pin is the Kelvin source connection, which routes the gate return directly to the source pad inside the package, bypassing the current-carrying source bond wires. This reduces the common-source inductance in the gate loop and improves switching performance, particularly at higher frequencies. The maximum power dissipation is 150 W at case temperature, so a heatsink with adequate thermal interface is assumed for continuous operation at the rated current. The device is ROHS3 compliant.

IMZ120R060M1HXKSA1
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