600 V / 6.5 A TrenchStop™ in a TO-252-3 — what the scorch mark tells you
The Infineon IKD03N60RFATMA1 is a TrenchStop™ IGBT with a 600 V collector-emitter breakdown voltage and 6.5 A continuous collector current, housed in a surface-mount TO-252-3 (DPak) package. It uses a Trench Field Stop structure with standard input logic, so it gates directly from a typical MCU or gate-driver output without a level shifter. The 17.1 nC gate charge keeps the drive current low — a 100 mA driver can switch it at 50 kHz without breaking a sweat.
Vce(sat) max is 2.5 V at 15 V gate drive and 2.5 A collector current — that's the conduction loss floor at the test condition. In a 2.5 A load, expect about 6.25 W conduction loss before switching losses. The switching energy numbers (50 µJ turn-on, 40 µJ turn-off at 400 V, 2.5 A, 68 Ω gate resistor, 15 V gate drive) tell you the total switching loss at 50 kHz is roughly 4.5 W — well within the 53.6 W power max rating, but the TO-252-3's thermal pad needs a good copper pour to keep junction temperature below 175 °C.
Package and board-fit reality
The PG-TO252-3 (DPak) footprint is standard — three leads plus the tab, 2.3 mm pitch. The tab is the collector, so the PCB copper pour under it doubles as the heatsink. Surface-mount reflow profile: typical 260 °C peak, but the 175 °C junction rating means the die itself can take the heat. No through-hole tab to solder — the whole joint is reflow, so inspect the tab wetting angle under the part after reflow; a cold joint under the tab is the failure signature you'll find on a dead PFC stage.