What this CIPOS module brings to the board
The Infineon IKCM20L60GAXKMA1 is a 600 V, 20 A three-phase IGBT module from the CIPOS™ series, packaged in a 24-PowerDIP through-hole module with 2000 Vrms isolation. It integrates the IGBTs, freewheeling diodes, and bootstrap diodes into a single 26.10 mm wide body, saving board space and simplifying the power stage layout for motor drives, inverters, and industrial power supplies. The through-hole mounting handles the thermal and mechanical stress of continuous switching better than a surface-mount solution would in this current class.
Lifecycle and sourcing reality
No end-of-life notice or last-time-buy window is in effect, so it can be specified into new designs without an immediate obsolescence risk.
Rework and handling note
The 24-PowerDIP through-hole package is a rework-friendly form factor — no hot-air station needed, just a soldering iron and a desoldering tool. The through-hole leads carry the thermal mass into the PCB copper planes; make sure the board has adequate via stitching under the module to pull heat into the bottom-layer copper. The module body is 26.10 mm wide, so check clearance to adjacent tall components on the board.