Device identity and key parametrics
The IKCM15F60GAXKMA1 is an Infineon CIPOS™ IGBT module rated for 15 A continuous collector current and 600 V blocking voltage, configured as a 3-phase bridge in a 24-PowerDIP through-hole package. With 2000Vrms isolation between the power stage and the control pins, this module suits motor-drive inverters where galvanic separation simplifies the PCB layout and reduces common-mode noise coupling to the microcontroller.
Package and board integration
The 24-PowerDIP module (1.028" body width, 26.10 mm length) mounts through-hole on a standard 2.54 mm pitch grid — the same footprint as many legacy DIP-24 power hybrids, so a board respin is rarely needed when migrating from an older IGBT module. The through-hole leads carry the full 15 A phase current; the thermal path runs through the exposed copper pads on the bottom of the module to the PCB copper pour, so the board's thermal vias and bottom-layer copper area set the junction-to-ambient resistance.
The module is ROHS3 compliant, covering the ten restricted substances plus the four phthalates, so it passes the material-declaration requirements for EU and UKCA markets without an exemption claim.