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Infineon Technologies IGP20N60H3XKSA1

IGP20N60H3XKSA1 IGBT, 600 V, 40 A, TrenchStop, TO-220-3

MPNIGP20N60H3XKSA1
End of Life

Infineon TrenchStop IGP20N60H3XKSA1, 600 V, 40 A, Trench Field Stop IGBT, 170 W, 120 nC gate charge, TO-220-3 through-hole, -40°C to 175°C junction temperature.

$2.07Ref. price · indicative, final on quote
PackagingTO-220-3
StockContact for availability
MOQ1 pcs
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Specifications

IGP20N60H3XKSA1 Technical Specifications
ParameterValue
SeriesTrenchStop®
IGBT typeTrench Field Stop
Input typeStandard
Mounting typeThrough Hole
Voltage - collector emitter breakdown600 V
Current - collector (Ic)40 A
Current - collector pulsed80 A
Power - max170 W
Operating temperature-40°C ~ 175°C (TJ)
PackageTube
Gate charge120 nC
CaseTO-220-3
Test condition400V, 20A, 14.6Ohm, 15V
Switching energy690µJ
Td (on/off) @ 25°C16ns/194ns
Vce(on) (Max) @ vge, ic2.4V @ 15V, 20A

Product details

600 V, 40 A TrenchStop IGBT for motor drives and power supplies

It is designed for hard-switching applications such as motor drives, uninterruptible power supplies, and welding inverters where low conduction and switching losses are required.

Conduction and switching loss budget

At 15 V gate drive and 20 A collector current, the typical Vce(on) is 2.4 V — this sets the conduction loss floor at 48 W for a 20 A load, before accounting for the temperature rise that increases Vce(on) per the datasheet's normalised curve. Switching energy is 690 µJ under test condition 400 V, 20 A, 14.6 Ohm gate resistor, 15 V gate drive. At a 20 kHz switching frequency, the total switching loss is roughly 13.8 W, which combined with conduction loss drives the heatsink requirement. Gate charge is 120 nC total — a typical gate driver delivering 1 A peak can charge the gate in about 120 ns, though the datasheet turn-on delay is 16 ns and turn-off delay 194 ns at 25°C.

Temperature range and package

The TO-220-3 package (PG-TO220-3-1) is a standard through-hole footprint with the collector tab on the metal back. The 170 W maximum power dissipation assumes the tab is bolted to a heatsink with thermal compound; free-air dissipation is significantly lower.

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