Package and mounting — surface-mount D²Pak
The IGB30N60H3ATMA1 comes in a TO-263-3 (D²Pak) surface-mount package, supplier package code PG-TO263-3-2. The large tab provides the collector connection and the primary heat path to the PCB copper pour. Reflow soldering is standard; the package is also available in Tape & Reel or Cut Tape options for volume assembly or prototype runs.
Lifecycle and compliance — active production, no LTB worry
It is ROHS3 compliant, so it meets the latest EU restriction directives for lead and other substances. The TrenchStop® series is a mature Infineon platform with long-term manufacturing commitment.
