IDL10G65C5XUMA2

Infineon Technologies · CoolSiC™+ Series

Infineon CoolSiC+ IDL10G65C5XUMA2, Silicon Carbide Schottky Diode, 650 V DC reverse voltage, 10 A average rectified current, 0 ns reverse recovery time, surface mount 4-PowerTSFN / PG-VSON-4 package, -55 to 150 °C junction temperature.

Infineon Technologies IDL10G65C5XUMA2
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

IDL10G65C5XUMA2 specifications
Parameter / AttributeSpecification / Value
SeriesCoolSiC™+
Diode typeSilicon Carbide Schottky
MountingSurface Mount
Voltage - DC reverse (Vr)650 V
Voltage - forward (Vf) (Max) @ if1.7 V @ 10 A
Current - reverse leakage @ vr180 µA @ 650 V
Current - average rectified10A
Operating temperature - junction-55°C ~ 150°C
SpeedNo Recovery Time > 500mA (Io)
PackageTape & Reel (TR); Cut Tape (CT)
Case4-PowerTSFN
Capacitance @ vr,300pF @ 1V, 1MHz
Reverse recovery time0 ns

Technical details

The IDL10G65C5XUMA2 is an Infineon CoolSiC+ silicon carbide Schottky diode rated at 650 V DC reverse voltage and 10 A average rectified current. Its defining characteristic is zero reverse recovery time — the datasheet lists 0 ns trr — which means the diode contributes no switching loss component from stored charge clearing. This is the main reason to pick a SiC Schottky over a silicon ultrafast diode in a hard-switched PFC or DC-DC converter: the recovery loss term drops out of the efficiency calculation entirely. Junction temperature spans -55 to 150 °C, covering industrial motor drives, server PSUs, and automotive on-board charger stages.

Forward drop and leakage — the static trade-off

At the full 10 A rated current the forward voltage is 1.7 V maximum. That is higher than a comparable silicon Schottky at the same current, which is the SiC trade-off: you accept higher conduction loss at high load in exchange for eliminating the switching loss that would dominate at high frequency. Reverse leakage at the full 650 V blocking voltage is 180 µA — a figure that rises with junction temperature, so the thermal design should account for the leakage power at the worst-case hot die temperature.

Surface-mount assembly; the small footprint suits compact power stages where board area is tight. The pad layout and solder stencil aperture should follow the Infineon application note for the VSON-4 to get the rated thermal performance.

ROHS3 compliant. No official second source is listed in the record, but the CoolSiC+ family includes several 650 V / 10 A SiC Schottky diodes in comparable packages from Infineon; the exact PG-VSON-4 footprint should be confirmed against the target layout.

IDL10G65C5XUMA2
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