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IDH16G120C5XKSA1

Infineon IDH16G120C5XKSA1 SiC Schottky Diode, 1.2 kV, 16 A

MPNIDH16G120C5XKSA1
End of Life

Infineon CoolSiC™+ IDH16G120C5XKSA1, Silicon Carbide Schottky Diode, 1200 V reverse voltage, 16 A average rectified current, 0 ns reverse recovery time, TO-220-2 through-hole package, -55°C to 175°C junction temperature.

$8.72Ref. price · indicative, final on quote
PackagingTO-220-2
RoHSROHS3 Compliant
SeriesCoolSiC™+
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

IDH16G120C5XKSA1 specifications
ParameterValue
SeriesCoolSiC™+
Diode typeSilicon Carbide Schottky
MountingThrough Hole
Voltage - DC reverse (Vr)1200 V
Voltage - forward (Vf) (Max) @ if1.95 V @ 16 A
Current - reverse leakage @ vr50 µA @ 1200 V
Current - average rectified16A
Operating temperature - junction-55°C ~ 175°C
SpeedNo Recovery Time > 500mA (Io)
PackageTube
CaseTO-220-2
Capacitance @ vr,730pF @ 1V, 1MHz
Reverse recovery time0 ns

Product details

1.2 kV SiC Schottky — the zero-recovery edge

The Infineon IDH16G120C5XKSA1 is a CoolSiC™+ generation silicon carbide Schottky diode rated for 1200 V reverse voltage and 16 A average rectified current. Its zero reverse recovery time (0 ns trr) eliminates the stored-charge losses that plague silicon ultrafast diodes in hard-switched topologies — no recovery tail, no ringing, no snubber required across the diode.

Forward drop and leakage at 175°C junction

Maximum forward voltage is 1.95 V at 16 A, 25°C junction. Reverse leakage at rated 1200 V is 50 µA — a figure that rises with temperature but stays well below the conduction-loss floor of a comparable silicon diode. The 730 pF junction capacitance at 1 V, 1 MHz matters for Coss-related switching losses in LLC or phase-shifted full-bridge designs.

Through-hole TO-220-2 — thermal and mechanical fit

Housed in a PG-TO220-2-1 through-hole package, the IDH16G120C5XKSA1 mounts into a standard TO-220 footprint. At 16 A continuous, a heatsink is required — the TO-220 tab is the thermal path, and the junction-to-case thermal impedance sets the heatsink size.

Frequently asked questions

Does IDH16G120C5XKSA1 need a heat sink?

Yes, at 16 A continuous forward current the TO-220-2 package requires a heatsink. The junction-to-case thermal impedance determines the heatsink size needed to keep the junction below 175°C at the target ambient temperature.

What is the difference between IDH16G120C5XKSA1 and IDH16G120C5?

The IDH16G120C5XKSA1 is the tape-and-reel / tube packaging variant of the same CoolSiC™+ die. The electrical ratings — 1200 V, 16 A, 0 ns trr, 1.95 Vf — are identical. The suffix indicates the shipping package (tube for the XKSA1 variant).