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Infineon Technologies IDH09G65C5XKSA2

Infineon IDH09G65C5XKSA2 SiC Schottky Diode

MPNIDH09G65C5XKSA2
End of Life

Infineon CoolSiC™+ IDH09G65C5XKSA2, Silicon Carbide Schottky Diode, 650 V DC Reverse Voltage, 9 A Average Rectified Current, Zero Reverse Recovery Time, -55°C to 175°C Junction, PG-TO220-2-1 Package.

$2.16Ref. price · indicative, final on quote
PackagingTO-220-2
SeriesCoolSiC™+
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

IDH09G65C5XKSA2 specifications
ParameterValue
SeriesCoolSiC™+
Diode typeSilicon Carbide Schottky
MountingThrough Hole
Voltage - DC reverse (Vr)650 V
Voltage - forward (Vf) (Max) @ if1.7 V @ 9 A
Current - reverse leakage @ vr160 µA @ 650 V
Current - average rectified9A
Operating temperature - junction-55°C ~ 175°C
SpeedNo Recovery Time > 500mA (Io)
PackageBulk
CaseTO-220-2
Capacitance @ vr,270pF @ 1V, 1MHz
Reverse recovery time0 ns

Product details

Why zero recovery time matters in hard-switched stages

In a hard-switched PFC or inverter leg, that eliminates the reverse-recovery current spike that costs efficiency and stresses the companion MOSFET or IGBT.

650 V blocking, 9 A continuous — the power envelope

Rated for 650 V DC reverse voltage and 9 A average rectified current. Forward voltage drop is 1.7 V maximum at the full 9 A rating. Reverse leakage is 160 µA at 650 V and 25 °C junction. Like all SiC Schottkys, leakage climbs with temperature, so the thermal design at 175 °C junction limit needs to account for the increased off-state loss — the datasheet's typical curve is the reference, not the 25 °C number.

175 °C junction — where it goes and what it needs

The 175 °C ceiling is higher than most standard Si fast-recovery diodes, making this part suitable for tightly packed power stages where the heatsink is small or the ambient is high.

TO-220-2 — rework-friendly, heatsink-ready

Housed in a standard TO-220-2 through-hole package (Infineon's PG-TO220-2-1 variant). Two leads, tab as the cathode — the same footprint as countless Si ultrafast diodes, so no board layout change if you are swapping a Si FRD for this SiC part. The through-hole tab takes a screw-down or clip-on heatsink easily, and the package reworks cleanly with a soldering iron or hot air — no risk of lifting a pad.

For a BOM line, that means no last-time-buy scramble and no forced requalification in the near term.

Frequently asked questions

What is the reverse recovery time of IDH09G65C5XKSA2?

The reverse recovery time (trr) is 0 ns. As a silicon carbide Schottky diode, it has no stored minority charge, so there is no reverse recovery event. This is the key performance advantage over ultrafast silicon diodes.